Offers an ideal combination of econometric theory and hands-on practical training for undergraduate and graduate courses. The author's ambition is to provide realistic applications without sacrificing theoretical underpinnings. He uses a logical step-by-step approach to walk readers through numerous real-world examples of model specification, estimation, and hypothesis testing. The book also succeeds at being self-contained. By including background information on mathematics, probability, statistics, and software applications, readers have all the information they need in one place.
Introductory Econometrics with Applications
|Формат:|| Страниц 832|
|Using R for Introductory Econometrics Ingram Heiss F. |
This book introduces the popular, powerful and free programming language and software package R with a focus on the implementation of standard tools and methods used in econometrics.
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|Shining Star Introductory Six Traits of Wtiting Pearson |
|Concepts, Applications, and Issues Biology of Humans: Prentice Hall Goodenough |
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A bold, beautiful anthology with a finger on creative talents to watch, this volume is a visually intoxicating treat for designers, artists and those who relish their genius.
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Несмотря на то, что была проведена серьезная работа по восстановлению первоначального качества издания, на некоторых страницах могут обнаружиться небольшие "огрехи": помарки, кляксы и т. п. Книга представляет собой репринтное издание 1856 года (издательство "London, Longman, Brown, Green, and Longmans").
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Quantum size effects due to the L- Valley degeneracy lifting are given special attention due to their usefulness in designing state of the art infrared devices.
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This work provided a sound foundation for future work focused on the optimization of material-specific coating conditions and in vivo biocompatibility study of OEG coated biomedical devices.
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Since this book demonstrated a novel sintering technique with superior performance even at high temperature (>800oC), it should be also useful to professionals in high power LED, laser device, and etc. With the large external pressure, the micro-scale silver paste can be sintered to form high-quality interconnection layer at 240oC. Because nanoscale silver particles have lower sintering temperature, several approaches were developed to address sintering challenges of nanoscale silver particles, such as particles aggregation, agglomeration, and non- densification diffusion at low temperature. This book should be helpful for researches and engineers in the power semiconductor assembling and applications. Silver interconnection has superior performance than current interconnection materials/techniques, including conductive adhesives and reflowed solders; but high processing temperature prevent its application. The external pressure, however, makes this technique difficult to implement. The low- temperature sintering nanoscale technique was successfully demonstrated in the interconnecting SiC device for high-temperature application.
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The theoretical and simulation results presented in this book will encourage more applications of adaptive control in safety sensitive systems.